Lithium Ion Battery (LIB) for X-ray Inspection Application Lithium-ion batteries (LIB, LFP, NMC) consist of alternating layers of cathode plates, anode plates, and separators inside a case. X-ray inspection systems are used to inspect the quality[...] Aluminum Electrolytic Capacitor for X-ray Inspection Application Quality inspections are crucial because internal faults like miswindings of the film inside electrolytic capacitors can cause fires. Electrolytic capacitor cannot be visually inspected once it has[...] Multi-conductor (multicore) cable disconnection X-ray inspection X-ray inspection is used to inspect the inside of the cables. Some electrically conductive cables may not conduct electricity because of the position or bending condition. In some cases, if wires[...] Insert molding (Injection molding) parts X-ray inspection Insert molding is a method of integrally molding metal parts such as terminals by using resin or rubber. Insert molded products may look normal from the outside, but metal-to-metal contact may c[...] Wire harness X-ray inspection In X-ray inspection of connectors and harnesses, molded connectors, crimped and press-fit parts, soldered parts, wires, and shielded wires are inspected to detect defects such as breaks and short[...] Sheathed Thermocouple X-Ray Inspection A thermocouple is a sensor that measures temperature by the Thermal Electromotive Force (EMF) generated at the contact point between two different metal wires. Thermal Electromotive Force (EMF) g[...] Wire bonding of IC chips for X-ray Inspection Application In semiconductor magnified X-ray inspections, the state of wire bonding is examined at an enlarged scale, checking for issues such as wire breakage, pitch deviation, and poor bonding. IC chip wire[...] Enlarged Observation of BGA Solder Joint The causes of BGA malfunctions include bump voids, cracks, warpages, and deformations. BGA bumps are located on the underside of the chip, and we cannot visually inspect them. The bump de[...] BGA solder condition for X-ray Inspection Application BGA stands for Ball Grid Array and is a semiconductor IC package with solder balls called bumps array on its bottom surface. When mounted on a printed circuit board (PCB), solder paste is[...] Biological skeleton X-ray imaging X-ray observation of the bones and skeletons of living organisms sometimes requires good density resolution and field size to view minute changes. The μRay8700-LF6, equipped with a 6-megapixel h[...] PREV 1 2 3 NEXT
