Inside a Type-C Charger The X-ray scan of Apple's genuine A1720 charger (18W, USB-PD-compatible) shows the circuit board, the AC pins for outlet connection on the left, the connector on the right, and the cord arrangeme[...] Inside a Wireless Charger and Smartphone The X-ray images reveal the internal structures of both devices. Wireless charging operates without physical connections, utilizing electromagnetic induction through coils. When current[...] Inside structure of Various AA and 18650 Batteries The X-ray comparison shows images of four different batteries arranged from left to right: an AA-size manganese battery, an alkaline battery, a nickel-metal hydride (rechargeable) battery, and an[...] USB Cable Analysis The X-ray images compare four different USB cables (from left to right): USB 2.0, USB Micro, USB 3.0, and Type-C cables. These represent the standard USB connector configurations: Type-A, Micro-B[...] Comparison of Stylus Pen's Inside X-ray Images The Apple Pencil, known for its sophisticated features, such as its tilt and pressure sensitivity that enables smooth writing, reveals a densely packed internal structure under X-ray examina[...] Multi-conductor (multicore) cable disconnection X-ray inspection X-ray inspection is used to inspect the inside of the cables. Some electrically conductive cables may not conduct electricity because of the position or bending condition. In some cases, if wires[...] Insert molding (Injection molding) parts X-ray inspection Insert molding is a method of integrally molding metal parts such as terminals by using resin or rubber. Insert molded products may look normal from the outside, but metal-to-metal contact may c[...] Wire harness X-ray inspection In X-ray inspection of connectors and harnesses, molded connectors, crimped and press-fit parts, soldered parts, wires, and shielded wires are inspected to detect defects such as breaks and short[...] Sheathed Thermocouple X-Ray Inspection A thermocouple is a sensor that measures temperature by the Thermal Electromotive Force (EMF) generated at the contact point between two different metal wires. Thermal Electromotive Force (EMF) g[...] X-Ray Inspection Examples (BGA, LED wire bonding, etc.) X-ray inspection of BGA (Ball Grid Array) and CSP (Chip Scale Package) is one of the non-destructive inspection methods to evaluate the solder joint condition. This inspection method [...]
