- Automatic Test Equipment (ATE)
- Burn-in
- Curve tracer (parameter analyzer)
- Dielectric Breakdown Testing
- Dielectric withstand test
- Electric Llight Source (Lamp, Artificial Light)
- Electron Beam
- Electron Beam (E-Beam) Evaporation
- Electron Beam (E-Beam) Welding
- Electron Beam Lithography (EBL)
- Electron Microscope
- Electrostatic Discharge (ESD) Testing
- Electrostatic chuck (E-Chuck, ESC)
- Electrostatic levitation
- Fast Atom Beam (FAB) Gun
- Focused Ion Beam (FIB)
- High Voltage Amplifier
- High Voltage Power Supply
- Insulation breakdown test
- Ion Beam
- Ion Implantation
- Ion Milling
- Ion Pump
- Ionizer
- Langmuir probe
- Nondestructive Testing (NDT)
- Photovoltaics (PV)
- Physical Vapor Deposition (PVD)
- Plating
- Power Amplifier
- RF amplifier
- Scanning Electron Microscope (SEM)
- Semiconductor Fabrication Equipment
- Sputtering
- Surface activated bonding (SAB)
- Transmission Electron Microscopes (TEM)
- Vacuum Gauge
- Vacuum Plasma Treatment
- X-Ray Analysis
- X-Ray Detector
- X-Ray Photoelectron Spectroscopy (XPS)
Semiconductor
Semiconductor Manufacturing Process
| Process | Matsusada Products/purpose |
|---|---|
| 1. Ingot Growth | - |
| 2. Ingot Slicing | - |
| 3. Wafer Cleaning | Vacuum Plasma Treatment |
| 4. Wafer Polishing | Piezo actuator, Piezo driver |
| 5. Thermal Oxide Wafer | Heater power supply |
| 6. Photoresist Coating | - |
| 7. Photolithography | Electron Beam Lithography (EBL) Piezo actuator, Piezo driver |
| 8. Stepper exposure | Piezo actuator, Piezo driver |
| 9. Etching | Dry Etching Plasma Etching Reactive-ion Etching (RIE) Atomic Layer Etching (ALE) Electrostatic chuck |
| 10. Deposition | Atomic Layer Deposition (ALD) Physical Vapor Deposition (PVD) Plasma Enhanced Chemical Vapor Deposition (PECVD) Electron Beam (E-Beam) Evaporation Ion Beam Deposition Heater power supply Electrostatic chuck |
| 11. Chemical Mechanical Planarization (CMP) | - |
| 12. Oxidation | - |
| 13. Ion implantation | Ion Beam, Ion Acceleration, Ion Beam Steering, Ion Source |
| 14. Diffusion | - |
| 15. Surface activated bonding (SAB) | Fast Atom Beam (FAB) Gun |
| 16. Wafer Inspection | - |
| 17. Wafer dicing | Photomultiplier Tubes (PMT) |
| 18. Wafer mounting | - |
| 19. Wafer bonding | Plating |
| 20. Integrated circuit packaging | Electron Beam (E-Beam) Welding |
| 21. Burn-in | Burn-in |
| 22. Testing and Inspection | Curve tracer (parameter analyzer) Device analyzer Drain-source on-state resistance measurement Common-Mode Transient Immunity (CMTI) test Dielectric Breakdown Testing Electrostatic Discharge Testing (ESD) Insulation breakdown testing Hipot testing Dielectric withstand test Electrical isolation test High Voltage Power Supply Electron Microscope Analytical X-Ray |
| 23. Marking | - |
| Overall process | Clean Room, Clean Booth,Clean Bench,Ion pump |