A Fast Atom Beam (FAB) gun generates a high-speed beam of neutral atoms used to prepare semiconductor wafer surfaces for room-temperature bonding. Unlike conventional ion guns, a FAB gun uses neutral atoms, which prevents charge-up on the substrate surface. This allows for the effective removal of oxide layers and other contaminants with minimal surface damage.
Systems incorporating FAB guns are integral to equipment used for Surface-Activated Bonding (SAB), a method of room-temperature wafer bonding.
For more information on Surface-Activated Bonding (SAB), please refer to our article on "Surface activated bonding (SAB)".
